EJOT® Pro BSOP HL

Applications

• To be used in combination with the base profiles (SOP) for the thermal bridge-reduced base formation of a thermal insulation composite system (ETICS).
• Available in projections of 60 mm, 100 mm and 160 mm, in combination with the base profiles (SOP) insulation thicknesses between 60 mm and 320 mm can be covered.

Properties

• thermal bridge-reduced base construction
• Maximum dimensional stability, ideal for heavy insulation materials such as mineral wool or wood fiber
• Aligned and plumb edges through rectangular connectors
• Wide range of applications with a small number of variants
• In combination with the base profiles suitable for insulation thicknesses from 60 mm to 320 mm

Technical specifications

• rigid PVC profile

Processing instructions
Align the base plinth profile horizontally and flush with the floor and fasten it with suitable screw dowels. Any unevenness in the substrate must be levelled out, e.g. with EJOT levelling pieces. Connect the profiles with the enclosed connector. After the profiles have been installed, the insulation panels are glued to the wall and placed on the base plinth profile and fastened. The profile and panel joints must be offset. Apply the reinforcement compound to the entire surface of the insulation edge in the width of the fabric strip. Connect the plinth profile (SOP) with the enclosed connector and embed it in the still fresh reinforcement compound and slide it between the wall insulation and the base plinth profile. We recommend using an appropriately dimensioned joint sealing tape between the perimeter insulation and the base plinth profile.

notes

• Store in a cool, dry place
• transport and storage lying down